更改I/O模块后环境关闭机箱温度过高
适用场景
- ONTAP 9
- AFF A900、FAS9500
- AFF A700 、 FAS9000
问题描述
- 在I/O模块(卡)从一种模块切换到另一种模块期间、节点会在ONTAP 重新启动后因温度问题而发生环境关闭
- 例如、X91440A (40GbE)模块已更换为X91153A (100GbE)模块:
A900-6-147-148::*> Aug 16 11:08:37 [A900-6-147:vifmgr.clus.linkdown:EMERGENCY]: The cluster port e4e on node A900-6-147 has gone down unexpectedly.
Aug 16 11:08:39 [A900-6-147:vifmgr.clus.linkdown:EMERGENCY]: The cluster port e4a on node A900-6-147 has gone down unexpectedly.
Aug 16 11:12:53 [A900-6-147:monitor.chassisTemperature.cool:ALERT]: Chassis temperature is too cool: IO4 200G SW DieTmp is critical low (0 C).
Aug 16 11:12:54 [A900-6-147:monitor.shutdown.chassisUnderTemp:error]: Chassis temperature is too cold: Temp on I/O Slot4 is critical low. System will be shutdown in 2 minutes
Aug 16 11:12:54 [A900-6-147:monitor.chassisTemperature.cool:ALERT]: Chassis temperature is too cool: IO4 200G CPLD DieTmp is critical low (0 C).
Aug 16 11:12:54 [A900-6-147:monitor.chassisTemperature.ok:notice]: Chassis temperature is ok.
***OS2SP configured successfully***Aug 16 11:13:24 [A900-6-147:callhome.chassis.undertemp:EMERGENCY]: Call home for CHASSIS UNDER TEMPERATURE SHUTDOWN
Aug 16 11:13:27 [A900-6-147:discover.6500.unsupported:notice]: FC-to-SAS bridge ATTO 6500N discovery is disabled.
Reservation conflict found on this node's disks!
Aug 16 11:16:56 [A900-6-147:monitor.ioCard.degraded:ALERT]: IO card is degraded: IO4 200G Hot Swap Cur is critical high (1920 mV).
Aug 16 11:17:16 [A900-6-147:monitor.ioCard.degraded:ALERT]: IO card is degraded: IO4 200G VCORE CX6 is critical high (4640 mV).
Continuing boot...
Aug 16 11:18:59 [A900-6-147:monitor.shutdown.emergency:EMERGENCY]: Emergency shutdown: Environmental Reason Shutdown (Temperature critical)
- 节点在重新启动回ONTAP 后恢复